JYD850 HOT AIR BLOWER

 

Application:

Suitable for unsoldering multiple components, such as SOIC, CHIP, QFP, PLCC and BGA. 
Applicable for hot contraction, heating, painting-removing, glue-removing, defrosting, preheating. 
For MacBook, Cellular phones, PDAs, handhelds, laptops, notebooks, and motherboards repair.